Evaluation of Cu-TSV Barrier Materials as a Solution to Copper Protrusion
Crossref DOI link: https://doi.org/10.1007/s11664-019-07894-0
Published Online: 2019-12-20
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zare, Yazdan http://orcid.org/0000-0001-7412-1284
Sasajima, Yasushi
Onuki, Jin
Text and Data Mining valid from 2019-12-20
Version of Record valid from 2019-12-20
Article History
Received: 18 July 2019
Accepted: 10 December 2019
First Online: 20 December 2019