Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications
Crossref DOI link: https://doi.org/10.1007/s11664-019-07916-x
Published Online: 2020-01-02
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Koga, Shunichi
Nishikawa, Hiroshi
Saito, Mikiko
Mizuno, Jun
Text and Data Mining valid from 2020-01-02
Version of Record valid from 2020-01-02
Article History
Received: 11 March 2019
Accepted: 18 December 2019
First Online: 2 January 2020