Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint
Crossref DOI link: https://doi.org/10.1007/s11664-020-08514-y
Published Online: 2020-10-15
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ahmed, Md. Tusher
Motalab, Mohammad http://orcid.org/0000-0003-2128-464X
Suhling, Jeffrey C.
Text and Data Mining valid from 2020-10-15
Version of Record valid from 2020-10-15
Article History
Received: 25 September 2019
Accepted: 22 September 2020
First Online: 15 October 2020
Conflict of interest
: The authors declare that they do not have any conflict of interest.