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Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

Crossref DOI link: https://doi.org/10.1007/s11664-021-09256-1

Published Online: 2021-10-13

Published Print: 2021-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Fan, Yaohui

Wu, Yifan

Dale, Travis F.

Lakshminarayana, Sukshitha Achar Puttur

Greene, Colin V.

Badwe, Nilesh U.

Aspandiar, Raiyo F.

Blendell, John E.

Subbarayan, Ganesh

Handwerker, Carol A. http://orcid.org/0000-0002-2660-1803
Funding

Funding for this research was provided by:

Intel Corporation (CG#41491149)
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Text and Data Mining valid from 2021-10-13

Version of Record valid from 2021-10-13
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Article History

Received: 5 June 2021

Accepted: 22 September 2021

First Online: 13 October 2021

Conflict of interest

: On behalf of all authors, the corresponding author states that there is no conflict of interest.

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