A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer
Crossref DOI link: https://doi.org/10.1007/s11664-023-10881-1
Published Online: 2024-01-17
Published Print: 2024-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hu, Yuhua
Zhang, Yan
Bao, Zuguo
Wu, Jing
Li, Jie
Wu, Jie
Huang, Min
Text and Data Mining valid from 2024-01-17
Version of Record valid from 2024-01-17
Article History
Received: 30 August 2023
Accepted: 4 December 2023
First Online: 17 January 2024
Conflict of interest
: The authors declare no conflict of interest.