Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength
Crossref DOI link: https://doi.org/10.1007/s11665-014-1115-4
Published Online: 2014-06-18
Published Print: 2014-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ho, Li-Ngee
Nishikawa, Hiroshi
Text and Data Mining valid from 2014-06-18