Thermal Properties, Electrochemical Behavior, and Microstructure of Zn-5Sn-2Cu-1.5Bi-xRE High-Temperature Solder
Crossref DOI link: https://doi.org/10.1007/s11665-015-1416-2
Published Online: 2015-02-24
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xing, Fei
Qiu, Xiaoming
Text and Data Mining valid from 2015-02-24