Effect of the Soldering Process on the Microstructure and Mechanical Properties of Sn-9Zn/Al Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11665-015-1577-z
Published Online: 2015-06-23
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yao, Yao
Feng, Xue
Jian, Zhou
Zhanying, Feng
Xu, Chen
Text and Data Mining valid from 2015-06-23