Transient Liquid Phase Diffusion Bonding of 6061Al-15 wt.% SiC p Composite Using Mixed Cu-Ag Powder Interlayer
Crossref DOI link: https://doi.org/10.1007/s11665-016-2165-6
Published Online: 2016-06-14
Published Print: 2016-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Roy, Pallab
Pal, Tapan Kumar
Maity, Joydeep
License valid from 2016-06-14