Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints
Crossref DOI link: https://doi.org/10.1007/s11665-020-04899-3
Published Online: 2020-06-23
Published Print: 2020-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Seo, Eunice Y.
Ryu, Jong E. http://orcid.org/0000-0002-8238-9130
Text and Data Mining valid from 2020-06-01
Version of Record valid from 2020-06-01
Article History
Received: 21 April 2020
Revised: 27 May 2020
First Online: 23 June 2020