Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties
Crossref DOI link: https://doi.org/10.1007/s11665-021-05518-5
Published Online: 2021-02-10
Published Print: 2021-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rajendran, Sri Harini
Kang, Hyejun
Jung, Jae Pil
Text and Data Mining valid from 2021-02-10
Version of Record valid from 2021-02-10
Article History
Received: 26 September 2020
Revised: 1 December 2020
Accepted: 21 January 2021
First Online: 10 February 2021
Free to read: This content has been made available to all.