Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging
Crossref DOI link: https://doi.org/10.1007/s11665-022-07752-x
Published Online: 2022-12-27
Published Print: 2023-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Al-sorory, Hamed
Gumaan, Mohammed S.
Shalaby, Rizk Mostafa
Text and Data Mining valid from 2022-12-27
Version of Record valid from 2022-12-27
Article History
Received: 29 May 2022
Revised: 5 November 2022
Accepted: 4 December 2022
First Online: 27 December 2022