Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study
Crossref DOI link: https://doi.org/10.1007/s11666-014-0150-x
Published Online: 2014-10-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Kai
Kong, Lingyan
Tao, Yongshan
Li, Tiefan
Xiong, Tianying
Text and Data Mining valid from 2014-10-04