Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming
Crossref DOI link: https://doi.org/10.1007/s11771-014-2396-3
Published Online: 2014-11-15
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Guo, Ming-hai
Liu, Jun-you
Jia, Cheng-chang
Jia, Qi-jin
Guo, Shi-ju
Text and Data Mining valid from 2014-11-01