Numerical Studies of Infiltration Dynamics of Liquid–Copper and Silicon/Solid–Carbon System
Crossref DOI link: https://doi.org/10.1007/s11837-014-0951-x
Published Online: 2014-04-23
Published Print: 2014-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Iqbal, K.
Sha, J. J.
Lei, Zhen-Kun
Maqsood, A.
Mujahid, M.
Text and Data Mining valid from 2014-04-23