Studies on thermal stability and life estimation of epoxy adhesive by thermogravimetric analysis for high-temperature applications
Crossref DOI link: https://doi.org/10.1007/s12034-020-02152-0
Published Online: 2020-07-01
Published Print: 2020-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
SRIVASTAVA, TANU
KATARI, NARESH KUMAR
RAO RAVURI, BALAJI http://orcid.org/0000-0002-5964-8229
KUSHWAHA, JUHI
MOHAN, S KRISHNA
JONNALAGADDA, SREEKANTHA B
Text and Data Mining valid from 2020-07-01
Version of Record valid from 2020-07-01
Article History
Received: 24 July 2019
Accepted: 25 May 2020
First Online: 1 July 2020