Change in properties upon thermal treatment of copper sulphide powder and thin films
Crossref DOI link: https://doi.org/10.1007/s12034-021-02379-5
Published Online: 2021-04-08
Published Print: 2021-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mohamed, S H
Awad, M A
Hafez, Mohamed Ismail
Hadia, N M A
Text and Data Mining valid from 2021-04-08
Version of Record valid from 2021-04-08
Article History
Received: 18 September 2020
Accepted: 19 November 2020
First Online: 8 April 2021