Metal–semiconductor interface engineering in layered 2D materials for device applications
Crossref DOI link: https://doi.org/10.1007/s12034-021-02512-4
Published Online: 2021-07-31
Published Print: 2021-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Moun, Monika http://orcid.org/0000-0003-0587-4199
Singh, Rajendra
Text and Data Mining valid from 2021-07-31
Version of Record valid from 2021-07-31
Article History
Received: 4 January 2021
Accepted: 23 May 2021
First Online: 31 July 2021