Process chain analysis of the dimensional integrity in a metal-insert polymer smart phone baseplate — from die casting to polymer injection molding
Crossref DOI link: https://doi.org/10.1007/s12206-015-0343-3
Published Online: 2015-04-14
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jin, Kai
Kim, Taesan
Kim, Naksoo
Kim, Byeonggon
Text and Data Mining valid from 2015-04-01