A two-dimensional simulation model for the molded underfill process in flip chip packaging
Crossref DOI link: https://doi.org/10.1007/s12206-015-0627-7
Published Online: 2015-07-11
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Guo, Xue-Ru
Young, Wen-Bin
Text and Data Mining valid from 2015-07-01