A model-based prognostic approach to predict interconnect failure using impedance analysis
Crossref DOI link: https://doi.org/10.1007/s12206-016-0910-2
Published Online: 2016-10-19
Published Print: 2016-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kwon, Daeil
Yoon, Jeongah
License valid from 2016-10-01