Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique
Crossref DOI link: https://doi.org/10.1007/s12206-020-0113-8
Published Online: 2020-02-03
Published Print: 2020-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Seong-Min
Kim, Yeon-Wook
Text and Data Mining valid from 2020-02-01
Version of Record valid from 2020-02-01
Article History
Received: 27 May 2019
Revised: 25 December 2019
Accepted: 25 December 2019
First Online: 3 February 2020