Crossmark

Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique

Crossref DOI link: https://doi.org/10.1007/S12206-020-0113-8

Published: 2020-02

Update policy: https://doi.org/10.1007/SPRINGER_CROSSMARK_POLICY

Authors

Lee, Seong-Min

Kim, Yeon-Wook
License Information

Text and Data Mining valid from 2020-02-01
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Article History

Received: 27 May 2019

Revised: 25 December 2019

Accepted: 25 December 2019

First Online: 3 February 2020