Evaluation of tensile stress-strain curve of electroplated copper film by characterizing indentation size effect with a single nanoindentation
Crossref DOI link: https://doi.org/10.1007/s12540-017-6461-y
Published Online: 2017-01-08
Published Print: 2017-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Si-Hoon
Kim, Young-Cheon
Lee, Sukbin
Kim, Ju-Young
License valid from 2017-01-01