Enhanced thermal diffusivity of copperbased composites using copper-RGO sheets
Crossref DOI link: https://doi.org/10.1007/s12540-017-7088-8
Published Online: 2017-11-14
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Sangwoo
Kwon, Hyouk-Chon
Lee, Dohyung
Lee, Hyo-Soo
License valid from 2017-11-01