Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
Crossref DOI link: https://doi.org/10.1007/s12540-019-00240-3
Published Online: 2019-03-14
Published Print: 2019-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Koo, Seok-Bon
Lee, Chang-Myeon
Kwon, Sang-Jun
Jeon, Jun-Mi
Hur, Jin-young
Lee, Hong-Kee http://orcid.org/0000-0002-2995-8736
Text and Data Mining valid from 2019-03-14
Article History
First Online: 14 March 2019