Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi
Crossref DOI link: https://doi.org/10.1007/s12540-020-00856-w
Published Online: 2020-08-31
Published Print: 2021-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
El-Taher, A. M. http://orcid.org/0000-0003-2384-5295
Razzk, A. F.
Text and Data Mining valid from 2020-08-31
Version of Record valid from 2020-08-31
Article History
Received: 23 May 2020
Accepted: 12 August 2020
First Online: 31 August 2020