Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process
Crossref DOI link: https://doi.org/10.1007/s12541-015-0262-3
Published Online: 2015-08-04
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Jongsu
Park, Sungsik
Park, Janghoon
Cho, Young Seek
Shin, Kee-Hyun
Lee, Dongjin
Text and Data Mining valid from 2015-08-01