Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region
Crossref DOI link: https://doi.org/10.1007/s12613-015-1048-4
Published Online: 2015-01-10
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Han, Yan-qiu
Ben, Li-hua
Yao, Jin-jin
Wu, Chun-jing
Text and Data Mining valid from 2015-01-01