Effects of normal stress, surface roughness, and initial grain size on the microstructure of copper subjected to platen friction sliding deformation
Crossref DOI link: https://doi.org/10.1007/s12613-016-1211-6
Published Online: 2016-01-28
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Deng, Shan-quan
Godfrey, Andrew-William
Liu, Wei
Zhang, Cheng-lu
Xu, Ben
Text and Data Mining valid from 2016-01-01