On the Fracture Toughness Measurement of Thin Film Coated Silicon Wafers
Crossref DOI link: https://doi.org/10.1007/s12633-014-9215-1
Published Online: 2014-08-05
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Chris
Pham, John
Text and Data Mining valid from 2014-08-05