Machining, Characterization and Optimization: A Novel Approach for Machining Channels on Silicon Wafer Using Tailor-Made Micro Abrasive Jet Machining
Crossref DOI link: https://doi.org/10.1007/s12633-021-01036-0
Published Online: 2021-03-06
Published Print: 2022-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tomy, Anu
Hiremath, Somashekhar S. http://orcid.org/0000-0002-6721-1430
Text and Data Mining valid from 2021-03-06
Version of Record valid from 2021-03-06
Article History
Received: 30 December 2020
Accepted: 24 February 2021
First Online: 6 March 2021
Declarations
:
: Not Applicable.
: Yes