Thermal Expandometer: A Device for Monitoring In-situ Foam Filling of Hollow Profiles Processed Through Powder Metallurgy
Crossref DOI link: https://doi.org/10.1007/s12666-020-02000-z
Published Online: 2020-05-28
Published Print: 2020-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chilla, Venkat http://orcid.org/0000-0003-0451-0086
Mondal, D. P.
Ram, G. D. Janaki
Mukherjee, M.
Text and Data Mining valid from 2020-05-28
Version of Record valid from 2020-05-28
Article History
Received: 18 December 2019
Accepted: 14 May 2020
First Online: 28 May 2020