Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion
Crossref DOI link: https://doi.org/10.1007/s13233-020-8135-8
Published Online: 2020-07-23
Published Print: 2020-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Sung Bum
Lee, Ho Sik
Son, Chang Bum
Kim, Sung Hee
Lee, Jun Young
Text and Data Mining valid from 2020-07-23
Version of Record valid from 2020-07-23
Article History
Received: 13 May 2020
Revised: 14 June 2020
Accepted: 17 June 2020
First Online: 23 July 2020