Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints
Crossref DOI link: https://doi.org/10.1007/s13369-015-1653-6
Published Online: 2015-04-04
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ani, F. Che
Jalar, A.
Ismail, R.
Othman, N. K.
Abdullah, M. Z.
Aziz, M. S. Abdul
Khor, C. Y.
Bakar, M. Abu
Text and Data Mining valid from 2015-04-04