Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications
Crossref DOI link: https://doi.org/10.1007/s13369-015-1986-1
Published Online: 2015-12-09
Published Print: 2016-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Che Ani, F.
Jalar, A.
Ismail, R.
Othman, N. K.
Khor, C. Y.
Samsudin, Z.
Abdullah, M. Z.
Azmi, A.
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