Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging
Crossref DOI link: https://doi.org/10.1007/s13369-017-2659-z
Published Online: 2017-06-15
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ishak, M. H. H.
Abdullah, M. Z.
Aziz, M. S. Abdul
Saad, A. A.
Abdullah, M. K.
Loh, W. K.
Ooi, R. C.
Ooi, C. K.
License valid from 2017-06-15