Effect of Process Temperature and Reaction Cycle Number on Atomic Layer Deposition of TiO2 Thin Films Using TiCl4 and H2O Precursors: Correlation Between Material Properties and Process Environment
Crossref DOI link: https://doi.org/10.1007/s13538-015-0383-2
Published Online: 2015-11-09
Published Print: 2016-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chiappim, W.
Testoni, G. E.
de Lima, J. S. B.
Medeiros, H. S.
Pessoa, Rodrigo Sávio
Grigorov, K. G.
Vieira, L.
Maciel, H. S.
Funding for this research was provided by:
FAPESP (2011/50773-0, 2015/05956-0)
CNPq (305496/2012-3, 446545/2014-7)
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