Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications
Crossref DOI link: https://doi.org/10.1007/s40194-014-0216-x
Published Online: 2014-12-24
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yan, Jianfeng
Zou, Guisheng
Liu, Lei
Zhang, Dongyue
Bai, Hailin
Wu, Ai-ping
Zhou, Y. Norman
Text and Data Mining valid from 2014-12-24