Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder
Crossref DOI link: https://doi.org/10.1007/s40194-019-00758-5
Published Online: 2019-06-15
Published Print: 2019-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kostolný, Igor
Koleňák, Roman
Hodúlová, Erika
Zacková, Paulína
Kusý, Martin
Text and Data Mining valid from 2019-06-15
Version of Record valid from 2019-06-15
Article History
Received: 26 December 2018
Accepted: 27 May 2019
First Online: 15 June 2019