Joining of Cf/SiC composite with Cu–Pd–V filler alloy and Mo interlayer
Crossref DOI link: https://doi.org/10.1007/s40194-020-01033-8
Published Online: 2021-01-03
Published Print: 2021-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Wenwen
Feng, Hongliang
Chen, Bo
Xiong, Huaping
Cheng, Yaoyong
Text and Data Mining valid from 2021-01-03
Version of Record valid from 2021-01-03
Article History
Received: 18 September 2019
Accepted: 14 November 2020
First Online: 3 January 2021