Study on the thermal load of the laser impulse metal bonding process to the metallized thermal sensitive substrate
Crossref DOI link: https://doi.org/10.1007/s40194-020-01040-9
Published Online: 2020-12-03
Published Print: 2021-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chung, W.-S. http://orcid.org/0000-0001-9148-0713
Nagel, F.
Olowinsky, A.
Gillner, A.
Funding for this research was provided by:
Fraunhofer Institute for Laser Technology (ILT)
Text and Data Mining valid from 2020-12-03
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Article History
Received: 30 October 2019
Accepted: 24 November 2020
First Online: 3 December 2020