Fabrication of Parts with Integrated Circuits by Selective Electroless Plating of Additively Manufactured Plastic Substrates
Crossref DOI link: https://doi.org/10.1007/s40684-020-00252-0
Published Online: 2020-09-04
Published Print: 2021-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Seonyeop
Lee, Inhwan
Kim, Hochan http://orcid.org/0000-0003-0134-3788
Funding for this research was provided by:
Ministry of Science, ICT and Future Planning (NRF-2017R1A2B4009386)
Text and Data Mining valid from 2020-09-04
Version of Record valid from 2020-09-04
Article History
Received: 5 March 2020
Revised: 20 July 2020
Accepted: 26 July 2020
First Online: 4 September 2020