A Full-Field Non-Contact Thermal Modal Testing Technique Under Ambient Excitation
Crossref DOI link: https://doi.org/10.1007/s40799-021-00441-9
Published Online: 2021-02-19
Published Print: 2021-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hu, Y. J.
Huang, Z. S.
Zhu, W. D. http://orcid.org/0000-0003-2707-2533
Li, H. L.
Funding for this research was provided by:
National Science Foundation (1763024)
Text and Data Mining valid from 2021-02-19
Version of Record valid from 2021-02-19
Article History
Received: 11 May 2020
Accepted: 12 January 2021
First Online: 19 February 2021