A Full-Field Non-Contact Thermal Modal Testing Technique Under Ambient Excitation
Crossref DOI link:
Update policy: https://doi.org/10.1007/SPRINGER_CROSSMARK_POLICY
Hu, Y. J.
Huang, Z. S.
Zhu, W. D.
Li, H. L.
Funding for this research was provided by:
National Science Foundation of Sri Lanka (1763024)
Text and Data Mining valid from 2021-02-19
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11 May 2020
12 January 2021
19 February 2021