Investigation of Droplet Evaporation on Copper Substrate with Different Roughness
Crossref DOI link: https://doi.org/10.1007/s42235-020-0069-5
Published Online: 2020-07-18
Published Print: 2020-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Xin
Liu, Zeyu
Wang, Li
Yan, Yuying
Text and Data Mining valid from 2020-07-01
Version of Record valid from 2020-07-01
Article History
First Online: 18 July 2020