Metal Plating on Mold Compound for EMI Shielding with Industrial Test Compliance
Crossref DOI link: https://doi.org/10.1007/s42341-018-0014-z
Published Online: 2018-02-28
Published Print: 2018-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tai, Min Fee
Kok, Swee Leong
Lee, Swee Kah
Goh, Soon Lock
Mukai, Kenichiroh
Kim, Ken
Text and Data Mining valid from 2018-02-28
Article History
Received: 25 November 2016
Revised: 21 November 2017
Accepted: 4 December 2017
First Online: 28 February 2018