A review on the joining of SiC for high-temperature applications
Crossref DOI link: https://doi.org/10.1007/s43207-020-00021-4
Published Online: 2020-02-06
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yoon, Dang-Hyok http://orcid.org/0000-0002-6539-5096
Reimanis, Ivar E.
Text and Data Mining valid from 2020-02-06
Version of Record valid from 2020-02-06
Article History
Received: 3 December 2019
Revised: 27 December 2019
Accepted: 27 December 2019
First Online: 6 February 2020