Sun, Cong
Duan, Jinchao
Lan, Dongxue
Liu, Zhenxin
Xiu, Shichao
Funding for this research was provided by:
National Natural Science Foundation of China (51775101)
Technology Project of Shenyang City (F16-205-1-02)
This article is maintained by: Elsevier
Article Title: Prediction about ground hardening layers distribution on grinding chatter by contact stiffness
Journal Title: Archives of Civil and Mechanical Engineering
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.acme.2018.06.010
Content Type: article
Copyright: © 2018 Politechnika Wrocławska. Published by Elsevier B.V. All rights reserved.