Crossmark

Analysis of the strengthening and recrystallization of electrolytic copper (Cu-ETP) and oxygen free copper (Cu-OF)

Crossref DOI link: https://doi.org/10.1016/j.acme.2018.09.008

Published Print: 2019-03

Update policy: https://doi.org/10.1016/elsevier_cm_policy

Authors

Zasadzińska, Małgorzata https://orcid.org/0000-0002-3455-3469
Knych, Tadeusz

Strzępek, Paweł

Jurkiewicz, Bartosz

Franczak, Krystian
License Information

Text and Data Mining valid from 2019-03-01
More Information

This article is maintained by: Elsevier

Article Title: Analysis of the strengthening and recrystallization of electrolytic copper (Cu-ETP) and oxygen free copper (Cu-OF)

Journal Title: Archives of Civil and Mechanical Engineering

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.acme.2018.09.008

Content Type: article

Copyright: © 2018 Politechnika Wrocławska. Published by Elsevier B.V. All rights reserved.