3D-printed microelectronics for integrated circuitry and passive wireless sensors
Crossref DOI link: https://doi.org/10.1038/micronano.2015.13
Published Online: 2015-07-20
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Sung-Yueh
Yang, Chen
Hsu, Wensyang
Lin, Liwei
Text and Data Mining valid from 2015-07-20
Version of Record valid from 2015-07-20
Article History
Received: 21 April 2015
Revised: 9 June 2015
Accepted: 9 June 2015
First Online: 20 July 2015
Competing interests
: The authors declare no competing financial interest.