Adhesive curing through low-voltage activation
Crossref DOI link: https://doi.org/10.1038/ncomms9050
Published Online: 2015-08-18
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ping, Jianfeng
Gao, Feng
Chen, Jian Lin
Webster, Richard D.
Steele, Terry W. J.
Text and Data Mining valid from 2015-08-18
Version of Record valid from 2015-08-18
Article History
Received: 20 May 2015
Accepted: 8 July 2015
First Online: 18 August 2015
Competing interests
: The authors declare no competing financial interests.